PIC12F1822-E/MF Microchip Technology, PIC12F1822-E/MF Datasheet - Page 354

• Manufacturer Part Number: PIC12F1822-E/MF
• Description: 3.5 KB Flash, 128 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core 8 D
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 12Fr

Specifications of PIC12F1822-E/MF

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 6
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DFN
• Processor Series: PIC12F
• Core: PIC
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC12F/LF1822/PIC16F/LF1823
30.6
DS41413B-page 354
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
= Junction Temperature.


JMAX
= Ambient Temperature.
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
150
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
8-pin PDIP package
8-pin DFN 3X3mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP 4x4mm package
16-pin QFN 4X4mm package
8-pin PDIP package
8-pin DFN 3X3mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP 4x4mm package
16-pin QFN 4X4mm package
PD = P
P
8-pin SOIC package
8-pin SOIC package
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2010 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))