PIC16F1527-E/MR Microchip Technology, PIC16F1527-E/MR Datasheet - Page 303

64-pin, 28KB Flash, 1536B RAM, 10-bit ADC, 10xCCP, 2xSPI, 2xMI2C, 2xEUSART, 2.3V

PIC16F1527-E/MR

Manufacturer Part Number
PIC16F1527-E/MR
Description
64-pin, 28KB Flash, 1536B RAM, 10-bit ADC, 10xCCP, 2xSPI, 2xMI2C, 2xEUSART, 2.3V
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16F1527-E/MR

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
28KB (16K x 14)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 5.5 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-VFQFN Exposed Pad
Core
PIC
Processor Series
PIC16F
Data Bus Width
8 bit
Maximum Clock Frequency
20 MHz
Data Ram Size
1536 B
Number Of Programmable I/os
54
Operating Supply Voltage
2.3 V to 5.5 V
Mounting Style
SMD/SMT
Interface Type
SPI, I2C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
25.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
 2011 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
PIN
SS
SS
, PIC16F1526/7 .......................................................................... -0.3V to +6.5V
, PIC16LF1526/7 ........................................................................ -0.3V to +4.0V
> V
(†)
DD
A
A
SS
)  20 mA
A
A
 +85°C for industrial.................................................................. 425 mA
 +125°C for extended ............................................................... 175 mA
 +85°C for industrial............................................................... 425 mA
 +125°C for extended ............................................................ 175 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
x {I
DD
–  I
PIC16(L)F1526/27
OH
} +  {(V
DD
– V
OH
) x I
DS41458B-page 303
OH
} +  (V
DD
+ 0.3V)
O
l x I
OL
).

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