SST89E58RD2-40-I-NJE Microchip Technology, SST89E58RD2-40-I-NJE Datasheet - Page 65

• Manufacturer Part Number: SST89E58RD2-40-I-NJE
• Description: 4.5 To 5.5V FlashFlex 8-bit 8051 Microcontroller 44 PLCC TUBE
• Manufacturer: Microchip Technology
• Series: FlashFlex®r

Specifications of SST89E58RD2-40-I-NJE

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 36
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 8K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LCC (J-Lead)
• Processor Series: FlashFlex51
• Core: C51
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Details

FlashFlex MCU
SST89E54RD2A/RDA / SST89E58RD2A/RDA
13.0 SYSTEM CLOCK AND CLOCK OPTIONS
13.1 Clock Input Options and Recom-
mended Capacitor Values for Oscillator
Shown in Figure 13-1 are the input and output of an inter-
nal inverting amplifier (XTAL1, XTAL2), which can be con-
figured for use as an on-chip oscillator.
When driving the device from an external clock source,
XTAL2 should be left disconnected and XTAL1 should be
driven.
At start-up, the external oscillator may encounter a higher
capacitive load at XTAL1 due to interaction between the
amplifier and its feedback capacitance. However, the
capacitance will not exceed 15 pF once the external signal
meets the V
Crystal manufacturer, supply voltage, and other factors
may cause circuit performance to differ from one applica-
tion to another. C1 and C2 should be adjusted appropri-
ately for each design. Table 13-1, shows the typical values
for C1 and C2 vs. crystal type for various frequencies
TABLE 13-2: Clock Doubling Features
©2008 Silicon Storage Technology, Inc.
Device
SST89E5xRD2A/RDA
FIGURE 13-1: Oscillator Characteristics
IL
and V
Using the On-Chip Oscillator
IH
C 1
C 2
specifications.
Machine Cycle
Clocks per
12
Standard Mode (x1)
XTAL2
XTAL1
V
Max. External Clock Frequency
SS
(MHz)
40
65
TABLE 13-1:Recommended Values for C1 and
More specific information about on-chip oscillator design
can be found in the FlashFlex Oscillator Circuit Design
Considerations application note.
13.2 Clock Doubling Option
By default, the device runs at 12 clocks per machine cycle
(x1 mode). The device has a clock doubling option to
speed up to 6 clocks per machine cycle. Please refer to
Table 13-2 for detail.
Clock double mode can be enabled either via the external
host mode or the IAP mode. Please refer to Table 4-2 for
the IAP mode enabling commands (When set, the EDC#
bit in SFST register will indicate 6 clock mode.).
The clock double mode is only for doubling the inter-
nal system clock and the internal flash memory, i.e.
EA#=1. To access the external memory and the peripheral
devices, careful consideration must be taken. Also note
that the crystal output (XTAL2) will not be doubled.
Ceramic
Crystal
Machine Cycle
Quartz
Clocks per
Oscillator
External
Signal
C2 by Crystal Type
6
External Clock Drive
Clock Double Mode (x2)
NC
Max. External Clock Frequency
XTAL2
XTAL1
V
SS
(MHz)
C1 = C2
20-30pF
40-50pF
S71339-02-000
20
1339 F32.0
Data Sheet
T13-1.0 1339
T13-2.0 1339
02/08