CY7C63723-SCT Cypress Semiconductor Corp, CY7C63723-SCT Datasheet - Page 51

• Manufacturer Part Number: CY7C63723-SCT
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C63723-SCT

• Lead Free Status / RoHS Status: Not Compliant

Table 11
left corner of the die which has coordinate (0,0).
Table 11. CY7C63722C-XC Probe Pad Coordinates in microns ((0,0) to bond pad centers)
Document #: 38-08022 Rev. *D
below shows the die pad coordinates for the CY7C63722C-XC. The center location of each bond pad is relative to the bottom
Pad Number
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
11
1
2
3
4
5
6
7
8
9
Die Step: 1907 x 3011 microns
Die Size: 1830.8 x 2909 microns
Die Thickness: 14 mils = 355.6 microns
Pad Size: 80 x 80 microns
Pin Name
XTALOUT
XTALIN
VREG
P0.5
P0.4
P0.0
P0.1
P0.2
P0.3
P1.0
P1.2
P1.4
P1.6
P1.7
P1.5
P1.3
P1.1
P0.7
P0.6
Vpp
Vss
Vss
Vcc
D–
D+
Cypress Logo
Y
Figure 56. Die Form
(0,0)
10
4
5
6
7
8
9
X
17
22
21
20
19
18
(1907, 3001)
(microns)
1066.55
1210.75
1449.75
1662.35
1735.35
1752.05
1752.05
1752.05
1752.05
1752.05
1393.25
1171.80
154.95
980.35
788.95
597.45
406.00
154.95
154.95
154.95
154.95
154.95
154.95
363.90
531.70
X
(microns)
2843.15
2843.15
2843.15
2687.95
2496.45
2305.05
2113.60
1922.05
1730.90
1832.75
2024.30
2215.75
2407.15
2598.65
2843.15
2843.15
2843.15
184.85
184.85
184.85
184.85
289.85
312.50
184.85
184.85
CY7C63722C
CY7C63723C
CY7C63743C
Y
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