MCIMX255AJM4A Freescale, MCIMX255AJM4A Datasheet - Page 123

• Manufacturer Part Number: MCIMX255AJM4A
• Manufacturer: Freescale

Specifications of MCIMX255AJM4A

• Lead Free Status / RoHS Status: Compliant

4.2
Table 98
Freescale Semiconductor
•
•
•
Contact Name
NGND_ADC
NVCC_ADC
FUSE_VDD
MPLL_GND
MPLL_VDD
BATT_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
Table 98. 17 17 mm Package Ground, Power Sense, and Reference Contact Assignments
shows the 17 17 mm package ground, power, sense, and reference contact assignments.
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
i.MX25 Applications Processor for Automotive Products, Rev. 4
P10
T17
U17
U18
Y13
W13
Figure 98.
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17 17 i.MX25 Production Package
Contact Assignment
123