AD7266BCP Analog Devices Inc, AD7266BCP Datasheet - Page 27

• Manufacturer Part Number: AD7266BCP
• Description: IC ADC 12BIT 3CHAN 2MSPS 32LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD7266BCP

• Design Resources: AD7266 SAR ADC in DC-Coupled Differential and Single-Ended Appls (CN0039)
• Number Of Bits: 12
• Sampling Rate (per Second): 2M
• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Converters: 2
• Power Dissipation (max): 33.6mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN, CSP Exposed Pad
• For Use With: EVAL-AD7266CBZ - BOARD EVALUATION FOR AD7266
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD7266BCP
AD7266BCPZ
AD7266BCPZ-REEL7
AD7266BCPZ-REEL
AD7266BSUZ
AD7266BSUZ-REEL7
AD7266BSUZ-REEL
EVAL-AD7266CB
EVAL-CONTROL BRD2
1
2
3
Z = Pb-free part.
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL Board for evaluation/demonstration purposes.
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators. To order a complete
evaluation kit, the particular ADC evaluation board (such as, EVAL-AD7266CB), the EVAL-CONTROL BRD2, and a 12 V transformer must be ordered. See the relevant
evaluation board technical note for more information.
1
1
2
1
1
1
1
3
INDICATOR
1.00
0.85
0.80
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
PIN 1
12° MAX
1.05
1.00
0.95
ROTATED 90° CCW
SEATING
PLANE
0.15
0.05
VIEW A
SEATING
PLANE
Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
BSC SQ
VIEW
TOP
5.00
Figure 48. 32-Lead Thin Quad Flat Package [TQFP]
0° MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
COMPLIANT TO JEDEC STANDARDS MS-026ABA
0.08 MAX
COPLANARITY
0.20
0.09
Dimensions shown in millimeters
Dimensions shown in millimeters
3.5°
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Thin Quad Flat Package (TQFP)
32-Lead Thin Quad Flat Package (TQFP)
32-Lead Thin Quad Flat Package (TQFP)
Evaluation Board
Control Board
7°
0°
BSC SQ
4.75
0.20 REF
Rev. A | Page 27 of 28
0.75
0.60
0.45
0.05 MAX
0.02 NOM
(SU-32-2)
MAX
1.20
0.60 MAX
COPLANARITY
VIEW A
BSC
0.50
0.40
0.30
0.50
0.08
1
8
32
9
LEAD PITCH
24
17
BSC
16
0.80
25
PIN 1
(BOTTOM VIEW)
0.60 MAX
9.00 BSC SQ
(PINS DOWN)
TOP VIEW
EXPOSED
PAD
0.45
0.37
0.30
32
9
25
16
1
8
3.50 REF
24
17
BSC SQ
7.00
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
SU-32-2
SU-32-2
SU-32-2
AD7266