MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 50

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

50
Table 26 QMU SRAM Interface Signals
*
Table 27 Power Supply Signals
C5NP
SIGNAL NAME
QCPAR
QCLK
QCMD0 - QCMD15
QDPAR
QDATA0 - QDATA31
QSFLOW
QXCTRL0
QXCTRL1
QXRQST
TOTAL PINS
SIGNAL NAME
VDD
During normal (non-scan) operation.
Power Supply Signals
QMU SRAM Interface
CHAPTER 2: SIGNAL DESCRIPTIONS
PIN #
A3, A11, A15, A23, A27, C1, C5, C13, C17, C25, C29,
E3, E7, E15, E19, E27, G5, G9, G17, G21, G29, I7, I11,
I19, I23, J12, K1, K9, K13, K21, K25, L14, M3, M11,
M15, M23, M27, O1, O5, O13, O17, O25, O29, Q3, Q7,
Q15, Q19, Q27, S5, S9, S17, S21, S29, U7, U11, U19,
U23, W1, W9, W13, W21, W25, Y3, Y11, Y15, Y23, Y27,
AA1, AA5, AA13, AA17, AA25, AA29, AC3, AC7, AC15,
AC19, AC27
Signals
PIN #
A10
G12
B10, C10, D10, E10, F10, B11, D11, F11,
A12, B12, C12, D12, E12, B13, D13, F13
A8
D1, F1, F2, B2, C2, D2, E2, B3, D3, F3, A4,
B4, C4, D4, E4, F4, B5, D5, F5, A6, B6, C6,
D6, E6, F6, B7, D7, F7, C8, D8, E8, F8
B9
D9
F9
B8
The QMU signals are described in
core clock frequency.
Power supply and ground signals are described in
Figure
6.
TOTAL
1
1
16
1
32
1
1
1
1
55
TOTAL
78
Table
TYPE
nc
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
nc
26. The QMU’s clock frequency is
TYPE
P
I/O*
nc
O
O
I/O
I/O
O
O
O
nc
Table 27
SIGNAL DESCRIPTION
Not used
Clock Signal to the memory ICs
Memory Address [15: 0] to the memory
ICs
Data parity
Memory Data
Not Used
Rd/Wr (Read is true high, write is true low)
Memory Address [16] to the memory ICs
Reserved
Note: Requires Pullup or Pulldown.
SIGNAL DESCRIPTION
Core Supply Voltage (1.8V Input)
and their pinouts are shown in
1
/
2
the internal