MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 93

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

Marking Codes
Reflow
Table 57 Package Measurements (Reference
Table 58
Table 58 C-5 Network Processor Marking Codes
Typical Reflow Profile for the C-5 Switch Module
1 Follow the guidelines recommended by your solder paste supplier.
Flux requrements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquidus.
SYMBOL
A
A
A
A
A
D
D
E
E
e
b
MARKING (EXPLANATION OF CODES)
Top
Bottom
Pin 1 Marking
1
1
2
3
4
1
temperature across the board and package.
explains the marking on the C-5 NP.
DEFINITION
Overall
Ball height
C4 and Die
Body thickness
Lid thickness
Body size
Ball footprint (X)
Body size
Ball footprint (Y)
Ball pitch
Ball diameter
Logo/Part#/Country of Origin/Date Code
N/A
Chamfered Corner
NOM. (MM)
5.63
0.89
0.88
2.26
1.6
37.50
35.56
37.50
35.56
1.27
0.89
Figure 26
and
MIN. (MM)
5.31
2.07
Figure 27
for Symbols)
MAX. (MM)
5.95
2.53
Marking Codes
V 04
95