MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 81

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

Timing Specifications
Executive Processor
The XP timing specifications include:
•
•
•
•
PCI Timing Specifications
The PCI timing is shown in
Figure 18 PCI Timing Diagram
Table 46 PCI Timing Description
SYMBOL
Tpc
Tpas
PCI Timing Specifications
MDIO Serial Interface Timing Specifications
Low Speed Serial Interface Timing Specifications
PROM Interface Timing Specifications
PARAMETER
PCI Cycle Time*
PAD/P_ctl† Setup
Figure 18
and described in
MIN
15.0
3.0
TYP
Table
MAX
46.
AC Timing Specifications
UNIT
ns
ns
V 04
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