MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 70

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

70
C5NP
Power and Thermal
Characteristics
CHAPTER 3: ELECTRICAL SPECIFICATIONS
Figure 9 Bringup Clock Timing Diagram
Table 38
version (Revision D0) of the C-5 NP.
Table 38 C-5 Network Processor Power and Thermal Characteristics
PARAMETER
Power Dissipation, P
Maximum Junction
Temperature, T
Thermal Resistance, junction
to case, φ
Thermal Resistance, junction
to ambient, φ
Thermal Resistance, junction
to printed circuit board, φ
provides the derived power and thermal characteristics for the production
JC
JA
J
D
JB
MIN
10.5
11.5
12.5
14.5
TYP
15.0
16.0
17.5
20.0
0.24
1.87
4.8
MAX
18.0
19.0
20.5
23.0
100
UNITS
W
o
o
o
o
C
C/W
C/W
C/W
TEST CONDITIONS
166MHz core clock (See Note 1)
180MHz core clock (See Note 1)
200MHz core clock (See Note 1)
233MHz core clock (See Note 1)
See Note 2
See Note 2
See Note 2