AD9726BSVZ Analog Devices Inc, AD9726BSVZ Datasheet - Page 8

• Manufacturer Part Number: AD9726BSVZ
• Description: IC DAC 16IT LVDS 400MSPS 80-TQFP
• Manufacturer: Analog Devices Inc
• Series: TxDAC+®r

Specifications of AD9726BSVZ

• Data Interface: Parallel
• Number Of Bits: 16
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 575mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Resolution (bits): 16bit
• Sampling Rate: 400MSPS
• Input Channel Type: Parallel
• Supply Current: 80mA
• Digital Ic Case Style: QFP
• No. Of Pins: 80
• Package: 80TQFP EP
• Resolution: 16 Bit
• Conversion Rate: 400 MSPS
• Digital Interface Type: Parallel
• Number Of Outputs Per Chip: 1
• Output Type: Current
• Full Scale Error: 0.003(Typ) %FSR
• Integral Nonlinearity Error: ±2.5 LSB
• Maximum Settling Time: 0.0105(Typ) us
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9726-EBZ - BOARD EVAL FOR AD9726
• Settling Time: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9726
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
DBVDD, AVDD1,
AVDD2
DVDD, CLKVDD,
ACVDD, ADVDD
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
REFIO, FSDAJ
IOUTA, IOUTB
CLK±
DB[15:0]±,
DCLK_IN±,
DCLK_OUT±
CSB, SCLK, SDIO,
SDO, RESET, REXT
SDR_EN, SPI_DIS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
With Respect to
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
AGND1
AGND1
CLKGND
DBGND
DBGND
ADGND
Rating
−0.3 V to 3.6 V
−0.3 V to 2.8 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD1
+ 0.3 V
−1.0 V to AVDD1
+ 0.3 V
−0.3 V to CLKVDD
+ 0.3 V
−0.3 V to DBVDD
+ 0.3 V
−0.3 V to DBVDD
+ 0.3 V
−0.3 V to ADVDD
+ 0.3 V
Rev. B | Page 8 of 24
THERMAL RESISTANCE
Thermal impedance can be lowered to 23°C/W by soldering the
exposed package pad to an external heat sink (for example, the
internal PCB copper ground plane). However, this is not necessary
for the power dissipation and operating temperature range of
the AD9726.
Table 6. Thermal Resistance
Package Type
80-Lead TQFP_EP Package, Thermally Enhanced
ESD CAUTION
θ
32
JA
Unit
°C/W