BOXDP965LTCK Intel, BOXDP965LTCK Datasheet - Page 65

• Manufacturer Part Number: BOXDP965LTCK
• Manufacturer: Intel

Specifications of BOXDP965LTCK

• Lead Free Status / Rohs Status: Compliant

Technical Reference
2.11 Thermal Considerations
CAUTION
o
A chassis with a maximum internal ambient temperature of 38
C at the processor fan
inlet is a requirement. Use a processor heatsink that provides omni-directional airflow
to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.13.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
o
voltage regulator area (shown in Figure 23) can reach a temperature of up to 85
C in
an open chassis.
Figure 23 shows the locations of the localized high temperature zones.
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