DSP56301AG80 Freescale Semiconductor, DSP56301AG80 Datasheet - Page 28

• Manufacturer Part Number: DSP56301AG80
• Description: IC DSP 24BIT 80MHZ GP 208-LQFP
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of DSP56301AG80

• Interface: Host Interface, SSI, SCI
• Clock Rate: 80MHz
• Non-volatile Memory: ROM (9 kB)
• On-chip Ram: 24kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Specifications
2.2 Absolute Maximum Ratings
2.3 Thermal Characteristics
2.4 DC Electrical Characteristics
2-2
Supply voltage
Supply Voltage
All input voltages excluding “5 V tolerant” inputs
All “5 V tolerant” input voltages
Current drain per pin excluding V
Operating temperature range
Storage temperature
Notes:
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal characterization parameter
Notes:
1.
2.
3.
1.
2.
3.
4.
GND = 0 V, V
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress
beyond the maximum rating may affect device reliability or cause permanent damage to the device.
CAUTION: All “5 V Tolerant” input voltages cannot be more than 3.95 V greater than the supply voltage; this restriction
applies to “power on,” as well as during normal operation. In any case, the input voltages must not be higher than 5.75 V. “5
V Tolerant” inputs are inputs that tolerate 5 V.
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per
JEDEC Specification JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
These are simulated values. See note 1 for test board conditions.
These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to
the test board.
Characteristics
Characteristic
CC
Rating
3
= 3.3 V ± 0.3 V, T
CC
2
and GND
1
1
Table 2-3.
Table 2-2.
3
DSP56301 Technical Data, Rev. 10
Table 2-1.
J
= –40°C to +100°C, CL = 50 pF
DC Electrical Characteristics
Symbol
Thermal Characteristics
V
CC
Maximum Ratings
R
R
Symbol
θJA
θJC
Ψ
or θ
or θ
JT
Symbol
JA
JC
T
V
V
V
T
STG
CC
IN5
I
IN
Min
J
3.0
TQFP
Value
49.5
7.2
4.7
6
GND – 0.3 to V
GND – 0.3 to V
PBGA
Typ
Value
3.3
48.4
–0.3 to +4.0
–40 to +100
–55 to +150
Value
9
5
10
3
1, 2
CC
CC
Freescale Semiconductor
+ 3.95
+ 0.3
PBGA
Value
25.2
—
—
Max
3.6
4
°
°
°
Unit
Unit
mA
°
°
C/W
C/W
C/W
Unit
V
V
V
C
C
V