EP2S30F672I4 Altera, EP2S30F672I4 Datasheet - Page 97

• Manufacturer Part Number: EP2S30F672I4
• Description: IC STRATIX II FPGA 30K 672-FBGA
• Manufacturer: Altera
• Series: Stratix® IIr

Specifications of EP2S30F672I4

• Number Of Logic Elements/cells: 33880
• Number Of Labs/clbs: 1694
• Total Ram Bits: 1369728
• Number Of I /o: 500
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 672-FBGA
• Family Name: Stratix II
• Number Of Logic Blocks/elements: 33880
• # I/os (max): 500
• Frequency (max): 711.24MHz
• Process Technology: 90nm (CMOS)
• Operating Supply Voltage (typ): 1.2V
• Logic Cells: 33880
• Ram Bits: 1369728
• Operating Supply Voltage (min): 1.15V
• Operating Supply Voltage (max): 1.25V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: 544-1899; EP2S30F672I4

Altera Corporation
May 2007
Each I/O bank has its own VCCIO pins. A single device can support
1.5-, 1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different
V
support the voltage-referenced standards (such as SSTL-2). The PLL
banks utilize the adjacent VREF group when voltage-referenced
standards are implemented. For example, if an SSTL input is
implemented in PLL bank 10, the voltage level at VREFB7 is the reference
voltage level for the SSTL input.
I/O pins that reside in PLL banks 9 through 12 are powered by the
VCC_PLL<5, 6, 11, or 12>_OUT pins, respectively. The EP2S60F484,
EP2S60F780, EP2S90H484, EP2S90F780, and EP2S130F780 devices do not
support PLLs 11 and 12. Therefore, any I/O pins that reside in bank 11 are
powered by the VCCIO3 pin, and any I/O pins that reside in bank 12 are
powered by the VCCIO8 pin.
Each I/O bank can support multiple standards with the same V
input and output pins. Each bank can support one V
example, when V
3.3-V PCI for inputs and outputs.
On-Chip Termination
Stratix II devices provide differential (for the LVDS or HyperTransport
technology I/O standard), series, and parallel on-chip termination to
reduce reflections and maintain signal integrity. On-chip termination
simplifies board design by minimizing the number of external
termination resistors required. Termination can be placed inside the
package, eliminating small stubs that can still lead to reflections.
Stratix II devices provide four types of termination:
■
■
■
■
CCIO
Differential termination (R
Series termination (R
Series termination (R
Parallel termination (R
level independently. Each bank also has dedicated VREF pins to
CCIO
is 3.3 V, a bank can support LVTTL, LVCMOS, and
S
S
) without calibration
) with calibration
T
) with calibration
D
)
Stratix II Device Handbook, Volume 1
REF
Stratix II Architecture
voltage level. For
CCIO
2–89
for