MPC8313CVRADDB Freescale Semiconductor, MPC8313CVRADDB Datasheet - Page 48

• Manufacturer Part Number: MPC8313CVRADDB
• Description: MPU POWERQUICC II PRO 516-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8313CVRADDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 267MHz
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8313E-RDB
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 16 KB
• I/o Voltage: 2.5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Program Memory Type: EEPROM/Flash
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Enhanced Local Bus
11.2
Table 46
Figure 36
48
Local bus cycle time
Input setup to local bus clock
Input hold from local bus clock
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
LALE output rise to LCLK negative edge
LALE output fall to LCLK negative edge
LALE output fall to LCLK negative edge
LALE output fall to LCLK negative edge
Local bus clock to output valid
Local bus clock to output high impedance for LAD
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of
3. All signals are measured from NV
4. Input timings are measured at the pin.
5.t
6.t
7.t
8. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
inputs and t
timing (LB) for the input (I) to go invalid (X) with respect to the time the t
clock one (1).
LCLK0 (for all other inputs).
signaling levels.
LBOTOT1
than the load on LAD output pins.
LBOTOT2
the load on LAD output pins.
LBOTOT3
output pins.
through the component pin is less than or equal to the leakage current specification.
describes the general timing parameters of the local bus interface.
Local Bus AC Electrical Specifications
and t
and t
and t
provides the AC test load for the local bus.
(first two letters of functional block)(reference)(state)(signal)(state)
LALETOT2
LALETOT3
LALETOT1
MPC8313E PowerQUICC
Parameter
should be used when RCWH[LALE] is set and the load on LALE output pin is at least 10 pF less than
should be used when RCWH[LALE] is set and the load on LALE output pin equals to the load on LAD
should be used when RCWH[LALE] is not set and the load on LALE output pin is at least 10 pF less
Output
Table 46. Local Bus General Timing Parameters
DD
/2 of the rising/falling edge of LCLK0 to 0.4 × NV
Figure 36. Local Bus AC Test Load
™
Z
0
II Pro Processor Hardware Specifications, Rev. 3
= 50 Ω
t
t
t
Symbol
t
t
t
t
(first two letters of functional block)(signal)(state)(reference)(state)
LALETOT1
LALETOT2
LALETOT3
t
t
LALEHOV
LBOTOT1
LBOTOT2
LBOTOT3
t
t
LBKHOV
LBKHOZ
for outputs. For example, t
LBIVKH
LBIXKH
t
LBK
LBK
1
R
clock reference (K) goes high (H), in this case for
L
= 50 Ω
–1.5
–5.0
–4.5
Min
1.0
1.5
2.5
15
—
—
—
7
3
DD
NV
of the signal in question for 3.3-V
DD
LBIXKH1
/2
Max
3.0
—
—
—
—
—
—
—
—
—
3
4
Freescale Semiconductor
symbolizes local bus
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes
3, 4
3, 4
for
6
2
5
7
5
6
7
3
8