TDA8007BHL/C3,118 NXP Semiconductors, TDA8007BHL/C3,118 Datasheet - Page 51

• Manufacturer Part Number: TDA8007BHL/C3,118
• Description: IC INTERFACE CARD MP 48-LQFP
• Manufacturer: NXP Semiconductors

Specifications of TDA8007BHL/C3,118

• Controller Type: Multiprotocol IC Card Interface
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 6 V
• Current - Supply: 315mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3520-2; 935272525118; TDA8007BHLBE-T

NXP Semiconductors
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.1.1
8.1.2
8.2
8.2.1
8.2.1.1
8.2.1.2
8.2.1.3
8.2.1.4
8.2.2
8.2.2.1
8.2.2.2
8.2.2.3
8.2.2.4
8.2.2.5
8.2.3
8.2.3.1
8.2.3.2
8.2.3.3
8.2.3.4
8.2.3.5
8.2.3.6
8.2.4
8.3
8.4
8.5
8.6
8.7
9
10
11
12
13
14
15
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 35
Thermal characteristics . . . . . . . . . . . . . . . . . 35
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 35
Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Application information. . . . . . . . . . . . . . . . . . 42
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 44
Handling information. . . . . . . . . . . . . . . . . . . . 45
Non-Multiplexed configuration . . . . . . . . . . . . . 7
Time-out configuration register . . . . . . . . . . . . 15
UART Receive Register (URR) . . . . . . . . . . . 17
Programmable Divider Register (PDR). . . . . . 24
UART Configuration Registers (UCR) 2 . . . . . 24
UART Configuration Registers (UCR) 1 . . . . . 26
Clock Configuration Registers (CCR) . . . . . . . 27
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Interface control . . . . . . . . . . . . . . . . . . . . . . . . 7
Multiplexed configuration . . . . . . . . . . . . . . . . . 9
Control registers . . . . . . . . . . . . . . . . . . . . . . . 10
General registers . . . . . . . . . . . . . . . . . . . . . . 13
Card select register . . . . . . . . . . . . . . . . . . . . 13
Hardware status register. . . . . . . . . . . . . . . . . 13
Time-out registers. . . . . . . . . . . . . . . . . . . . . . 14
ISO UART registers . . . . . . . . . . . . . . . . . . . . 17
UART Transmit Register (UTR) . . . . . . . . . . . 17
Mixed Status Register (MSR) . . . . . . . . . . . . . 18
FIFO Control Registers (FSR) . . . . . . . . . . . . 22
UART Status Register (USR) . . . . . . . . . . . . . 22
Card registers . . . . . . . . . . . . . . . . . . . . . . . . . 24
Guard Time Registers (GTR) . . . . . . . . . . . . . 26
Power Control Registers (PCR) . . . . . . . . . . . 28
register summary . . . . . . . . . . . . . . . . . . . . . . 30
Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Step up converter . . . . . . . . . . . . . . . . . . . . . . 32
ISO 7816 security . . . . . . . . . . . . . . . . . . . . . . 32
Activation sequence . . . . . . . . . . . . . . . . . . . . 33
Deactivation sequence . . . . . . . . . . . . . . . . . . 34
16
16.1
16.2
16.3
16.4
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Soldering of SMD packages . . . . . . . . . . . . . . 45
Revision history . . . . . . . . . . . . . . . . . . . . . . . 48
Legal information . . . . . . . . . . . . . . . . . . . . . . 49
Contact information . . . . . . . . . . . . . . . . . . . . 50
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Introduction to soldering. . . . . . . . . . . . . . . . . 45
Wave and reflow soldering. . . . . . . . . . . . . . . 45
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 46
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 46
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 49
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Multiprotocol IC card interface
TDA8007BHL
Document identifier: TDA8007BHL
Date of release: 11 January 2011
All rights reserved.