DSPIC30F2020-30I/SP Microchip Technology Inc., DSPIC30F2020-30I/SP Datasheet - Page 274
![no-image](/images/manufacturer_photos/0/4/440/microchip_technology_inc__sml.jpg)
DSPIC30F2020-30I/SP
Manufacturer Part Number
DSPIC30F2020-30I/SP
Description
DSP, 16-Bit, 12KB Flash, 512 RAM, 21 I/O, SDIP-28
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet
1.DSPIC30F2023-30IPT.pdf
(286 pages)
Specifications of DSPIC30F2020-30I/SP
A/d Inputs
8-Channels, 10-Bit
Comparators
4
Cpu Speed
30 MIPS
Eeprom Memory
0 Bytes
Input Output
21
Interface
I2C/SPI/UART
Ios
21
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SPDIP
Programmable Memory
12K Bytes
Ram Size
512 Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
3-5.5
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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- Download datasheet (5Mb)
dsPIC30F1010/202X
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body (QFN)
DS70178C-page 272
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
2
1
Preliminary
E
EXPOSED
A
NOTE 1
PAD
E2
Units
A1
A3
E2
D2
N
D
e
A
E
b
L
K
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
—
© 2006 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
b
K
e
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