NAND01GR3B2CZA6E Micron Technology Inc, NAND01GR3B2CZA6E Datasheet - Page 62

• Manufacturer Part Number: NAND01GR3B2CZA6E
• Manufacturer: Micron Technology Inc

Specifications of NAND01GR3B2CZA6E

• Cell Type: NAND
• Density: 1Gb
• Access Time (max): 25us
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 8b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Program/erase Volt (typ): 1.7 to 1.95V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 1.95V
• Word Size: 8b
• Number Of Words: 128M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / Rohs Status: Compliant

Package mechanical
12
Figure 38. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline
1. Drawing is not to scale.
Table 26.
62/67
Symbol
CP
A1
A2
D1
E1
L1
A
B
C
E
α
e
L
Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
RoHS compliant specifications are available at www.numonyx.com.
TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data
D1
DIE
24
1
12.00
20.00
18.40
0.10
1.00
0.22
0.50
0.60
0.80
Typ
3°
millimeters
E1
11.90
19.80
18.30
E
0.05
0.95
0.17
0.10
0.50
Min
0°
–
12.10
20.20
18.50
Max
1.20
0.15
1.05
0.27
0.21
0.08
0.70
5°
–
48
25
C
B
e
CP
A2
0.004
0.039
0.009
0.472
0.787
0.724
0.020
0.024
0.031
Typ
3°
A1
L1
inches
0.002
0.037
0.007
0.004
0.468
0.779
0.720
0.020
L
Min
0°
–
TSOP-G
A
NAND01G-B2C
0.047
0.006
0.041
0.011
0.008
0.003
0.476
0.795
0.728
0.028
Max
5°