MT41J64M16JT-15E:G Micron Technology Inc, MT41J64M16JT-15E:G Datasheet - Page 111

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MT41J64M16JT-15E:G

Manufacturer Part Number
MT41J64M16JT-15E:G
Description
MICMT41J64M16JT-15E:G DDR3 SDRAM 64MB X1
Manufacturer
Micron Technology Inc
Series
-r
Type
DDR3 SDRAMr

Specifications of MT41J64M16JT-15E:G

Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
1G (64M x 16)
Speed
667MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
96-TFBGA
Organization
64Mx16
Density
1Gb
Address Bus
16b
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
355mA
Pin Count
96
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Table 68:
DLL RESET
Write Recovery
PDF: 09005aef826aa906/Source: 09005aef82a357c3
1Gb_DDR3_4.fm - Rev. F 11/08 EN
Length
4 chop
Burst
8
Burst Order
WRITE
READ/
WRITE
WRITE
READ
READ
Notes:
Starting Column
1. Internal READ and WRITE operations start at the same point in time for BC4 as they do for
2. Z = Data and strobe output drivers are in tristate.
3. V = A valid logic level (0 or 1), but the respective input buffer ignores level-on input pins.
4. X = “Don’t Care.”
DLL RESET is defined by MR0[8] (see Figure 54 on page 110). Programming MR0[8] to
“1” activates the DLL RESET function. MR0[8] is self-clearing, meaning it returns to a
value of “0” after the DLL RESET function has been initiated.
Anytime the DLL RESET function is initiated, CKE must be HIGH and the clock held
stable for 512 (
allow time for the internal clock to be synchronized with the external clock. Failing to
wait for synchronization to occur may result in invalid output timing specifications,
such as
WRITE recovery time is defined by MR0[11:9] (see Figure 54 on page 110). Write recovery
values of 5, 6, 7, 8, 10, or 12 may be used by programming MR0[11:9]. The user is
required to program the correct value of write recovery and is calculated by dividing
(ns) by
roundup (
(A[2, 1, 0])
Address
BL8.
V V V
0 V V
1 V V
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
t
t
CK (ns) and rounding up a noninteger value to the next integer: WR (cycles) =
DQSCK timings.
t
WR [ns]/
t
DLLK) clock cycles before a READ command can be issued. This is to
Burst Type = Sequential
t
CK [ns]).
0, 1, 2, 3, X, X, X, X
4, 5, 6, 7, X, X, X, X
0, 1, 2, 3, Z, Z, Z, Z
1, 2, 3, 0, Z, Z, Z, Z
2, 3, 0, 1, Z, Z, Z, Z
3, 0, 1, 2, Z, Z, Z, Z
4, 5, 6, 7, Z, Z, Z, Z
5, 6, 7, 4, Z, Z, Z, Z
6, 7, 4, 5, Z, Z, Z, Z
7, 4, 5, 6, Z, Z, Z, Z
0, 1, 2, 3, 4, 5, 6, 7
1, 2, 3, 0, 5, 6, 7, 4
2, 3, 0, 1, 6, 7, 4, 5
3, 0, 1, 2, 7, 4, 5, 6
4, 5, 6, 7, 0, 1, 2, 3
5, 6, 7, 4, 1, 2, 3, 0
6, 7, 4, 5, 2, 3, 0, 1
7, 4, 5, 6, 3, 0, 1, 2
0, 1, 2, 3, 4, 5, 6, 7
(Decimal)
111
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Burst Type = Interleaved
1Gb: x4, x8, x16 DDR3 SDRAM
0, 1, 2, 3, X, X, X, X
4, 5, 6, 7, X, X, X, X
0, 1, 2, 3, Z, Z, Z, Z
1, 0, 3, 2, Z, Z, Z, Z
2, 3, 0, 1, Z, Z, Z, Z
3, 2, 1, 0, Z, Z, Z, Z
4, 5, 6, 7, Z, Z, Z, Z
5, 4, 7, 6, Z, Z, Z, Z
6, 7, 4, 5, Z, Z, Z, Z
7, 6, 5, 4, Z, Z, Z, Z
0, 1, 2, 3, 4, 5, 6, 7
1, 0, 3, 2, 5, 4, 7, 6
2, 3, 0, 1, 6, 7, 4, 5
3, 2, 1, 0, 7, 6, 5, 4
4, 5, 6, 7, 0, 1, 2, 3
5, 4, 7, 6, 1, 0, 3, 2
6, 7, 4, 5, 2, 3, 0, 1
7, 6, 5, 4, 3, 2, 1, 0
0, 1, 2, 3, 4, 5, 6, 7
(Decimal)
©2006 Micron Technology, Inc. All rights reserved.
Operations
Notes
1, 3, 4
1, 3, 4
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 3
1
1
1
1
1
1
1
1
t
WR

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