LH28F016SCHR-L95 Sharp Electronics, LH28F016SCHR-L95 Datasheet - Page 21

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LH28F016SCHR-L95

Manufacturer Part Number
LH28F016SCHR-L95
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F016SCHR-L95

Cell Type
NOR
Density
16Mb
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21b
Operating Supply Voltage (typ)
3.3/5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3.3/5/12V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7/4.5V
Operating Supply Voltage (max)
3.6/5.5V
Word Size
8b
Number Of Words
2M
Supply Current
50mA
Mounting
Surface Mount
Pin Count
40
Lead Free Status / Rohs Status
Not Compliant
16M Flash Memory
Power Dissipation
consider battery power consumption not only during
device operation, but also for data retention during sys-
tem idle time. Flash memory’s nonvolatility increases
usable battery life because data is retained when sys-
tem power is removed.
extremely low power consumpution even when system
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
NOTES:
1. ‘Operating temperature’ is for the commercial temperature product defined by this specification.
2. All specified voltages are with respect to GND. Minimum DC voltage is -0.5 V on
3. Maximum DC voltage on V
4. Output shorted for no more than one second. No more than one output shorted at a time.
Stressing the device beyond the ‘Absolute Maximum Ratings’
may cause permanent damage. These are stress ratings
only. Operation beyond the ‘Operating Conditions’ is not rec-
ommended and extended exposure beyond the ‘Operating
Conditions’ may affect device reliability.
Data Sheet
Operating Temperature
Storage Temperature
Voltage on any pin
V
V
RP Voltage
Output Short Circuit Current
CC
PP
When designing portable systems, designers will
In addition, deep power-down mode ensures
input/output pins and -0.2 V on V
undershoot to -2.0 V for periods < 20 ns. Maximum DC voltage on input/output pins is
V
CC
Supply Voltage
Supply Voltage
+ 0.5 V which, during transitions, may overshoot to V
PARAMETER
CAUTION
PP
and RP may overshoot to +14.0 V for periods < 20 ns.
During Read, Block Erase, Byte Write, and
Lock Bit Configuration
Under Bias
Except V
During Block Erase, Byte Write and Lock Bit
Configuration
With respect to GND during Lock Bit
Configuration Operations
CC
and V
PP
CC
pins. During transitions, this level may
, V
PP
CONDITION
, and RP
CC
+ 2.0 V for periods < 20 ns.
power needs to remain applied. For example, portable
computing products and other power sensitive applica-
tions that use an array of devices for solid-state storage
can consume far less power by lowering RP to V
standby or sleep modes. If access is needed, the
devices can be read following the t
wake-up cycles required after RP is first raised to V
See ‘AC Characterstics, Read Only and Write Opera-
tions’ and Figures 15, 16, and 17 for more information.
-2.0 V
-2.0 V
-2.0 V
-2.0 V
-10°C
-65°C
MIN.
0°C
100 mA
125°C
14.0 V
14.0 V
MAX.
7.0 V
7.0 V
70°C
80°C
NOTE
2, 3
2, 3
1
2
2
4
PHQV
LH28F016SCT
and t
PHWL
IH
21
IL
.

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