TE28F800B3B110 Intel, TE28F800B3B110 Datasheet - Page 25

• Manufacturer Part Number: TE28F800B3B110
• Manufacturer: Intel

Specifications of TE28F800B3B110

• Lead Free Status / Rohs Status: Not Compliant

4.2
Figure 3.
Datasheet
Dimensions
TSOP Package
TSOP Package Drawing
Notes:
1.
2.
3.
Seating Plane Coplanarity
Package Body Thickness
Lead to Package Offset
Package Body Width
Pin 1
Terminal Dimension
Plastic Body Length
Lead Tip Length
Package Height
Lead Thickness
Lead Tip Angle
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 is in the upper left corner of the package, in reference to the product mark.
Lead Count
Lead Width
Lead Pitch
Standoff
Z
Intel
b
Detail B
®
Order Number: 290580, Revision: 020
See Det ail A
Advanced Boot Block Flash Memory (B3)
See Notes 1, 2, 3 and 4
Symbol
D1
A1
A2
A
E
D
N
Ø
Y
Z
b
c
e
L
Family: Thin Small Out -Line Package
18.200 18.400 18.600
11.800 12.000 12.200
19.800 20.000 20.200
D
0.050
0.950
0.150
0.100
0.500
0.150
D
Min
1
0°
Millimeters
1.000
0.200
0.150
0.500
0.600
0.250
Nom
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
48
3°
1.200
1.050
0.300
0.200
0.700
0.100
0.350
Det ail A
Max
5°
Notes
A
L
E
0.002
0.037
0.006
0.004
0.717
0.465
0.780
0.020
0.006
Min
0°
C
A
2
0
Inches
0.0197
0.039
0.008
0.006
0.724
0.472
0.787
0.024
0.010
Nom
48
3°
0.047
0.041
0.012
0.008
0.732
0.480
0.795
0.028
0.004
0.014
Seating
Plane
Max
A
5°
e
1
See Detail B
Notes
Y
A5568- 02
18 Aug 2005
25