TE28F800B3T90 Intel, TE28F800B3T90 Datasheet - Page 47

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TE28F800B3T90

Manufacturer Part Number
TE28F800B3T90
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F800B3T90

Cell Type
NOR
Density
8Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
512K
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
9.0
9.1
9.1.1
9.1.2
Datasheet
Power and Reset Specifications
Power-Up/Down Characteristics
To prevent any condition that might result in a spurious write or erase operation, power-up V
and V
Also power-up V
before V
If V
applying VCCQ and VPP. Device inputs must not be driven before supply voltage = VCCMin.
Power supply transitions must occur only when RP# is low.
RP# Connected to System Reset
Use RP# during system reset with automated program/erase devices, because the system expects to
read from the flash memory when the system exits reset. If a CPU reset occurs without a flash
memory reset, proper CPU initialization does not occur, because the flash memory might be
providing status information instead of array data. Connecting RP# to the system CPU RESET#
signal to allow proper CPU/flash initialization after a system reset.
System designers must guard against spurious writes when V
both WE# and CE# must be low for a command write, driving either signal to V
the flash memory device. The CUI architecture provides additional protection, because memory
contents can be altered only after successful completion of the two-step command sequences. The
flash memory device is also disabled until RP# is brought to V
control inputs. By holding the device in reset (RP# connected to system POWERGOOD) during
power-up/down, invalid bus conditions during power-up can be masked, providing yet another
level of memory protection.
V
The CUI latches commands as issued by system software, and is not altered by V
transitions or WSM actions. The CUI default state upon power-up, after exit from reset mode or
after V
After any program or Block-Erase operation is complete (even after V
V
flash-memory array is required.
PPLK
CC
CCQ
, V
CCQ
), the CUI must be reset to read-array mode, using the Read Array command if access to the
CC
CC
and/or VPP are not connected to the V
PP,
transitions above V
together. Conversely, V
.
and RP# Transitions
Intel
PP
®
with or slightly after V
Order Number: 290580, Revision: 020
Advanced Boot Block Flash Memory (B3)
LKO
CC
(Lockout voltage), is read-array mode.
and V
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
CC
CCQ
. Conversely, V
CC
must power-down together.
supply, then V
CC
PP
IH
voltages are above V
must power-down with or slightly
, regardless of the state of its
CC
must attain V
PP
transitions down to
IH
PP
inhibits writes to
CC
or CE#
Min before
LKO
18 Aug 2005
. Because
CC
47

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