CY39200V388-181MGC Cypress Semiconductor Corp, CY39200V388-181MGC Datasheet - Page 9

• Manufacturer Part Number: CY39200V388-181MGC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY39200V388-181MGC

• Family Name: Delta39K
• Memory Type: SRAM
• # Macrocells: 3072
• Number Of Usable Gates: 200000
• Propagation Delay Time: 8.5ns
• # I/os (max): 294
• Operating Supply Voltage (typ): 2.5/3.3V
• Ram Bits: 491520
• In System Programmable: Yes
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

I/O Banks
The Delta39K interfaces the horizontal and vertical routing
channels to the pins through I/O banks. There are eight I/O
banks per device as shown in Figure 7, and all I/Os from an
I/O bank are located in the same section of a package for PCB
layout convenience.
Delta39K devices support True Vertical Migration™ (i.e., for
each package type, Delta39K devices of different densities
keep given pins in the same I/O banks). This allows for easy
and simple implementation of multiple I/O standards during the
design and prototyping phase, before a final density has been
determined. Please refer to the application note titled “Family,
Package and Density Migration in Delta 39K and Quantum38K
CPLDs.”
Each I/O bank contains several I/O cells, and each I/O cell
contains an input/output register, an output enable register,
programmable slew rate control and programmable bus hold
control logic. Each I/O cell drives a pin output of the device;
the cell also supplies an input to the device that connects to a
dedicated track in the associated routing channel.
Each I/O bank can use any supported I/O standard by
supplying appropriate V
uring the I/O through the Warp software. All the V
V
and V
number of I/O standards supported by an I/O bank at any given
time.
The number of I/Os which can be used in each I/O bank
depend on the type of I/O standards and the number of V
and GND pins being used. This restriction is derived from the
electromigration limit of the V
chip. Please refer to the note on page 17 and the application
note titled “Delta39K Family Device I/O Standards and Config-
urations” for details.
Document #: 38-03039 Rev. *I
CCIO
CCIO
pins in an I/O bank must be connected to the same V
voltage respectively. This requirement restricts the
REF
and 512 x 8 block sizes
4K x 1, 2K x 2, 1K x 4,
Async/Sync Dual-Port
and V
4096-bit Dual-Port
CCIO
Configurable as
Configurable as
or Sync FIFO
CCIO
Figure 6. Block Diagram of Channel Memory Block
and GND bussing on the
Array
voltages and config-
inputs are driven from
the routing channels
All channel memory
Horizontal Channel
drive dedicated tracks in the
All channel memory outputs
routing channels
REF
CCIO
and
REF
I/O Cell
Figure 8 is a block diagram of the Delta39K I/O cell. The I/O
cell contains a three-state input buffer, an output buffer, and a
register that can be configured as an input or output register.
The output buffer has a slew rate control option that can be
used to configure the output for a slower slew rate. The input
of the device and the pin output can each be configured as
registered or combinatorial; however, only one path can be
configured as registered in a given design.
The output enable in an I/O cell can be selected from one of
the four global control signals or from one of two Output
Control Channel (OCC) signals. The output enable can be
configured as always enabled or always disabled or it can be
controlled by one of the remaining inputs to the mux. The
selection is done via a mux that includes V
inputs.
Figure 7. Delta39K I/O Bank Block Diagram
bank 7
bank 2
Global Clock
GCLK[3:0]
Signals
Delta39K
Delta39K
Delta39K™ ISR™
bank 6
bank 3
CPLD Family
CC
and GND as
Page 9 of 86