AM486DX5-133W16BHC AMD (ADVANCED MICRO DEVICES), AM486DX5-133W16BHC Datasheet - Page 56

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AM486DX5-133W16BHC

Manufacturer Part Number
AM486DX5-133W16BHC
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of AM486DX5-133W16BHC

Family Name
Am486
Device Core Size
32b
Frequency (max)
133MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.45V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3.3V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
208
Package Type
SQFP
Lead Free Status / Rohs Status
Not Compliant

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10
The following sections describe recommended electri-
cal connections and electrical specifications for the En-
hanced Am486DX microprocessors.
10.1 Power and Grounding
10.1.1 Power Connections
With 16 Kbyte of cache, the Enhanced Am486DX mi-
croprocessors have modest power requirements. How-
ever, the high clock frequency output buffers can cause
power surges as multiple output buffers drive new signal
levels simultaneously. For clean, on-chip power distri-
bution at high frequency, 23 V
feed the microprocessor in the 168-pin PGA package.
The 208-pin SQFP package includes 53 V
38 V
Power and ground connections must be made to all
external V
circuit board, all V
Likewise, all V
plane.
The Enhanced Am486DX microprocessors require only
3.3 V as input power. Unlike other 3-V processors, the
Enhanced Am486DX microprocessors do not require a
V
devices on the system motherboard. For socket com-
patibility, this pin is INC, allowing the Enhanced
Am486DX microprocessors to operate in 3-V sockets
in systems that use 5-V I/O.
CC5
SS
input of 5 V to indicate the presence of 5-V I/O
pins.
ELECTRICAL DATA
CC
and V
SS
pins must connect to a common GND
CC
SS
pins must connect to a V
pins of the microprocessors. On a
CC
pins and 28 V
Enhanced Am486DX Microprocessor Family
CC
P R E L I M I N A R Y
CC
pins and
SS
plane.
pins
10.1.2 Power Decoupling Recommendations
Liberal decoupling capacitance should be placed near
the microprocessor. The microprocessor, driving its 32-
bit parallel address and data buses at high frequencies,
can cause transient power surges, particularly when
driving large capacitive loads.
Low inductance capacitors and interconnects are rec-
ommended for best high-frequency electrical perfor-
mance. Inductance can be reduced by shortening
circuit- board traces between the microprocessor and
the decoupling capacitors. Capacitors designed specif-
ically for use with PGA packages are commercially avail-
able.
10.1.3 Other Connection Recommendations
For reliable operation, always connect unused inputs to
an appropriate signal level. Active Low inputs should be
connected to V
the range of 20 K
puts should be connected to GND.
CC
through a pull-up resistor. Pull-ups in
are recommended. Active High in-

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