TE28F160S375 Intel, TE28F160S375 Datasheet - Page 3

no-image

TE28F160S375

Manufacturer Part Number
TE28F160S375
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F160S375

Cell Type
NOR
Density
16Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21/20Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7/3.3/5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
2M/1M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
1.0 INTRODUCTION .............................................5
2.0 PRINCIPLES OF OPERATION .....................10
3.0 BUS OPERATION .........................................12
4.0 COMMAND DEFINITIONS ............................13
1.1 New Features...............................................5
1.2 Product Overview.........................................5
1.3 Pinout and Pin Description ...........................6
2.1 Data Protection ..........................................11
3.1 Read ..........................................................12
3.2 Output Disable ...........................................12
3.3 Standby......................................................12
3.4 Deep Power-Down .....................................12
3.5 Read Query Operation ...............................12
3.6 Read Identifier Codes Operation ................13
3.7 Write ..........................................................13
4.1 Read Array Command................................16
4.2 Read Query Mode Command.....................17
4.3 Read Identifier Codes Command ...............25
4.4 Read Status Register Command................25
4.5 Clear Status Register Command................26
4.6 Block Erase Command ..............................26
4.7 Full Chip Erase Command .........................26
4.8 Write to Buffer Command...........................27
ADVANCE INFORMATION
4.2.1 Query Structure Output .......................17
4.2.2 Query Structure Overview ...................19
4.2.3 Block Status Register ..........................20
4.2.4 CFI Query Identification String.............21
4.2.5 System Interface Information...............22
4.2.6 Device Geometry Definition .................23
4.2.7 Intel-Specific Extended Query Table ...24
CONTENTS
PAGE
5.0 DESIGN CONSIDERATIONS ........................39
6.0 ELECTRICAL SPECIFICATIONS..................40
APPENDIX A: Device Nomenclature and
APPENDIX B: Additional Information ...............52
4.9 Byte/Word Write Command ........................27
4.10 STS Configuration Command...................28
4.11 Block Erase Suspend Command ..............28
4.12 Program Suspend Command ...................28
4.13 Set Block Lock-Bit Commands .................29
4.14 Clear Block Lock-Bits Command ..............29
5.1 Three-Line Output Control..........................39
5.2 STS and WSM Polling ................................39
5.3 Power Supply Decoupling ..........................39
5.4 V
5.5 V
5.6 Power-Up/Down Protection ........................39
6.1 Absolute Maximum Ratings ........................40
6.2 Operating Conditions..................................40
Ordering Information ..................................51
6.2.1 Capacitance.........................................41
6.2.2 AC Input/Output Test Conditions .........41
6.2.3 DC Characteristics...............................42
6.2.4 AC Characteristics - Read-Only
6.2.5 AC Characteristics - Write Operations .46
6.2.6 Reset Operations.................................48
6.2.7 Erase, Program, And Lock-Bit
PP
CC
, V
Trace on Printed Circuit Boards...........39
Operations..........................................44
Configuration Performance.................49
PP
, RP# Transitions..........................39
28F160S3, 28F320S3
PAGE
3

Related parts for TE28F160S375