TE28F160S375 Intel, TE28F160S375 Datasheet - Page 52

• Manufacturer Part Number: TE28F160S375
• Manufacturer: Intel

Specifications of TE28F160S375

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 75ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7/3.3/5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 30mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

28F160S3, 28F320S3
NOTES:
1. Please call the Intel Literature Center at [phone] to request Intel documentation. International customers should
2. Visit Intel’s World Wide Web home page at http://www.intel.com for technical documentation and tools.
52
contact their local Intel or distribution sales office.
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ADDITIONAL INFORMATION
Word-Wide FlashFile Memory
AP-645 28F160S3/S5 Compatibility with 28F016SA/SV
AP-646 Common Flash Interface (CFI) and Command Sets
Common Flash Interface Specification
28F016SV 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
28F016SA 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
16-Mbit Flash Product Family User’s Manual
AP-374 Flash Memory Write Protection Techniques
AP-393 28F016SV Compatibility with 28F016SA
AP-607 Multi-Site Layout Planning with Intel’s FlashFile™ Components,
Including ROM Capability
AP-610 Flash Memory In-System Code and Data Update Techniques
Mechanical Specification BGA* Package Preliminary Guide
Surface Mount and PCB Guidelines for BGA* Packaging
Multi-Site Layouts: 56-lead TSOP to 56-bump BGA* package
CFI - Common Flash Interface Reference Code
APPENDIX B
56-lead SSOP to 56-bump BGA package
Document/Tool
TM
ADVANCE INFORMATION
Family 28F160S5, 28F320S5 Datashee t
(1,2)