MT29F4G08ABBDAH4:D Micron Technology Inc, MT29F4G08ABBDAH4:D Datasheet - Page 13

• Manufacturer Part Number: MT29F4G08ABBDAH4:D
• Description: MICMT29F4G08ABBDAH4:D 4G SLC NAND FLASH
• Manufacturer: Micron Technology Inc

Figure 6: 63-Ball VFBGA (10.5mm x 13mm)
PDF: 09005aef83b25735
m60a_4gb_nand.pdf – Rev. J 9/11 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
63X Ø0.45
Seating
plane
0.12 A
8.8 CTR
0.8 TYP
A
Note:
10
1. All dimensions are in millimeters.
9
8
7
10.5 ±0.1
7.2 CTR
0.8 TYP
6
5
4
3
2
1
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
13
A
B
C
D
E
F
G
H
J
K
L
M
0.65 ±0.05
13 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Ball A1 ID
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.