SC68C752BIB48,157 NXP Semiconductors, SC68C752BIB48,157 Datasheet - Page 44
![IC UART DUAL 48LQFP](/photos/6/64/66484/568-48-lqfp_sot313-2_sml.jpg)
SC68C752BIB48,157
Manufacturer Part Number
SC68C752BIB48,157
Description
IC UART DUAL 48LQFP
Manufacturer
NXP Semiconductors
Datasheet
1.SC68C752BIBS128.pdf
(48 pages)
Specifications of SC68C752BIB48,157
Number Of Channels
2, DUART
Package / Case
48-LQFP
Fifo's
64 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
Mounting Type
Surface Mount
Data Rate
5 Mbps
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.25 V
Supply Current
4.5 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
2.5 V or 3.3 V or 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935278767157
SC68C752BIB48
SC68C752BIB48
SC68C752BIB48
SC68C752BIB48
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC68C752BIB48,157
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
SC68C752B_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
26.
Rev. 04 — 20 January 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
26) than a SnPb process, thus
≥ 350
220
220
SC68C752B
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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