LPC2939 NXP Semiconductors, LPC2939 Datasheet - Page 77
LPC2939
Manufacturer Part Number
LPC2939
Description
The LPC2939 combine an ARM968E-S CPU core with two integrated TCM blocksoperating at frequencies of up to 125 MHz, Full-speed USB 2
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2939.pdf
(99 pages)
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Table 38.
V
ground; positive currents flow into the IC; unless otherwise specified.
[1]
[2]
[3]
Table 39.
V
T
specified.
[1]
LPC2939_3
Product data sheet
Symbol
t
Symbol
f
t
f(o)
SPI
su(SPI_MISO)
vj
DD(CORE)
DD(CORE)
=
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
Bus capacitance C
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
40
[1]
C to +85
= V
= V
Dynamic characteristic: I
Dynamic characteristics of SPI pins
DD(OSC_PLL)
DD(OSC_PLL)
Parameter
SPI operating frequency
SPI_MISO set-up time
9.3 Dynamic characteristics: I
9.4 Dynamic characteristics: SPI
Parameter
output fall time
C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
b
from 10 pF to 400 pF.
; V
; V
Fig 27. SPI data input set-up time in SSP Master mode
DD(IO)
DD(IO)
SDOn
SCKn
shifting edges
SDIn
= 2.7 V to 3.6 V; V
= 2.7 V to 3.6 V; V
2
C-bus pins
All information provided in this document is subject to legal disclaimers.
Conditions
master operation
slave operation
T
measured in SPI
Master mode;
see
Rev. 03 — 7 April 2010
DDA(ADC3V3)
DDA(ADC3V3)
amb
Figure 27
Conditions
V
= 25 C;
amb
amb
IH
to V
= 25 C (final testing). Both pre-testing and final testing use correlated
= 25 C (final testing). Both pre-testing and final testing use correlated
2
C-bus interface
= 3.0 V to 3.6 V; all voltages are measured with respect to
IL
= 3.0 V to 3.6 V; V
t
su(SPI_MISO)
[1]
ARM9 microcontroller with CAN, LIN, and USB
Min
20 + 0.1 C
Min
1
1
-
65024
65024
DDA(ADC5V0)
f
f
clk(SPI)
clk(SPI)
b
[3]
Typ
-
-
11
Typ
-
= 3.0 V to 5.5 V;
[2]
sampling edges
LPC2939
© NXP B.V. 2010. All rights reserved.
Max
1
1
-
2
4
amb
amb
Max
-
f
f
clk(SPI)
clk(SPI)
= 85 C ambient
= 85 C ambient
002aae695
Unit
MHz
MHz
ns
77 of 99
Unit
ns