MG74K Oki Semiconductor, MG74K Datasheet - Page 5

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MG74K

Manufacturer Part Number
MG74K
Description
0.15?m Customer Structured Array
Manufacturer
Oki Semiconductor
Datasheet
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ARRAY ARCHITECTURE
The primary components of a 0.15µm MG74K/75K/76K circuit include:
Each array has 24 dedicated corner pads for power and ground use during wafer probing, with six pads
per corner. The arrays also have separate power rings for the internal core functions (V
and output drive transistors (V
• I/O base cells
• 60µm pad pitch
• Configurable I/O pads for V
• V
• Separate power bus for output buffers
• Separate power bus for internal core logic and input buffers
• Core base cells containing N-channel and P-channel pairs, arranged in column of gates
• Isolated gate structure for reduced input capacitance and increased routing flexibility
• Innovative 4-transistor core cell architecture, licensed from In-Chip Systems, Inc
DD
and V
Configurable I/O pads
1, 2, 3, 4, 5, and 6
interconnection in
for V
V
corner for wafer probing only
SS
DD
DD
pads dedicated to wafer probing
, V
layer metal
, V
core area
SS
SS
pads (6) in each
, or I/O
DDO
I/O base cells
DD
Figure 1. MG76K Array Architecture
and V
, V
SS
, or I/O (optimized 3.3V I/O, 5V tolerant I/O)
SSO
).
Separate power bus (V
over I/O cell for output buffers.
Separate power bus (V
for internal core logic.
Oki Semiconductor
DDO
DDC
, V
Core base cell
with 4 transistors
, V
SSO
SSC
)
MG74K/75K/76K
)
DDC
and V
SSC
3
)

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