ADZS-BF537-EZLITE Analog Devices, ADZS-BF537-EZLITE Datasheet - Page 57

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ADZS-BF537-EZLITE

Manufacturer Part Number
ADZS-BF537-EZLITE
Description
Specifications: Type: DSP ; Contents: Evaluation Board, Software and Documentation ; For Use With/Related Products: ADSP-BF537 ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant
Manufacturer
Analog Devices
Datasheet
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
P
and the tables on
Values of
circuit board design considerations.
order approximation of T
where:
T
Values of
circuit board design considerations when an external heat sink
is required. Values of
and printed circuit board design considerations.
In
with JEDEC standards JESD51-2 and JESD51-6, and the junc-
tion-to-board measurement complies with JESD51-8. Test
board and thermal via design comply with JEDEC standards
JESD51-9 (BGA). The junction-to-case measurement complies
with MIL-STD-883 (Method 1012.1). All measurements use a
2S2P JEDEC test board.
Industrial applications using the 208-ball BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
D
J
CASE
A
JT
= Junction temperature (
Table 46
= Power dissipation (see the power dissipation discussion
= Ambient temperature (
= From
= Case temperature (
JA
JC
through
Table 46
are provided for package comparison and printed
are provided for package comparison and printed
Page 28
T
Table
J
T
=
J
JB
=
are provided for package comparison
T
for the method to calculate P
J
°
48, airflow measurements comply
CASE
by the equation:
T
°
C) measured by customer at top
°
C)
A
C)
+
+
JA
JT
JA
P
can be used for a first
D
P
D
Rev. I | Page 57 of 68 | July 2010
D
).
Table 46. Thermal Characteristics (182-Ball BGA)
Table 47. Thermal Characteristics (208-Ball BGA without
Thermal Vias in PCB)
Table 48. Thermal Characteristics (208-Ball BGA with
Thermal Vias in PCB)
ADSP-BF534/ADSP-BF536/ADSP-BF537
Parameter
Parameter
Parameter
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JT
JT
JT
JT
JT
JT
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
32.80
29.30
28.00
20.10
7.92
0.19
0.35
0.45
Typical
23.30
20.20
19.20
13.05
6.92
0.18
0.27
0.32
Typical
22.60
19.40
18.40
13.20
6.85
0.16
0.27
0.32
Unit
°
°
°
°
°
°
°
°
Unit
°
°
°
°
°
°
°
°
Unit
°
°
°
°
°
°
°
°
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W

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