MPC8260A Motorola, MPC8260A Datasheet - Page 43

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MPC8260A

Manufacturer Part Number
MPC8260A
Description
Micro Processor
Manufacturer
Motorola
Datasheet

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1.5.2
Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
MOTOROLA
Mechanical Dimensions
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MPC826xA (HiP4) Family Hardware Specifications
Notes:
1. Dimensions and Tolerancing per
2. Dimensions in millimeters.
3. Dimension b is measured at the
4. Primary data A and the seating
ASME Y14.5M-1994.
maximum solder ball diameter,
parallel to primary data A.
plane are defined by the spherical
crowns of the solder balls.
Package Description
Dim
D1
A1
A2
A3
E1
A
D
E
b
e
1.45
0.60
0.85
0.25
0.65
Min
Millimeters
37.50 BSC
35.56 REF
37.50 BSC
35.56 REF
1.27 BSC
Max
1.65
0.70
0.95
0.85
43

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