PIC12F639 Microchip Technology, PIC12F639 Datasheet - Page 38
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F639
Manufacturer Part Number
PIC12F639
Description
(PIC12F635 / PIC12F636 / PIC12F639) 8/14-PIN FLASH-BASED / 8-BIT CMOS MICROCONTROLLERS WITH NANOWATT TECHNOLOGY
Manufacturer
Microchip Technology
Datasheet
1.PIC12F639.pdf
(196 pages)
- Current page: 38 of 196
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
FIGURE 3-7:
3.7
The Fail-Safe Clock Monitor (FSCM) is designed to
allow the device to continue to operate in the event of
an oscillator failure. The FSCM can detect oscillator
failure at any point after the device has exited a Reset
or Sleep condition and the Oscillator Start-up Timer
(OST) has expired.
FIGURE 3-8:
The FSCM function is enabled by setting the FCMEN
bit in the Configuration Word register (Register 12-1). It
is applicable to all external clock options (LP, XT, HS,
EC, RC or I/O modes).
In the event of an external clock failure, the FSCM will
set the OSFIF bit (PIR1<2>) and generate an oscillator
fail interrupt if the OSFIE bit (PIE1<2>) is set. The
device will then switch the system clock to the internal
oscillator. The system clock will continue to come from
the internal oscillator unless the external clock recovers
and the Fail-Safe condition is exited.
DS41232B-page 36
LFINTOSC
Oscillator
(~32 s)
Primary
31 kHz
Program Counter
Clock
System Clock
Fail-Safe Clock Monitor
INTOSC
OSC1
OSC2
(~2 ms)
488 Hz
÷ 64
TWO-SPEED START-UP
FSCM BLOCK DIAGRAM
Q1
0
(edge-triggered)
Clock Monitor
Latch (CM)
C
S
Q2
1
T
T
OST
Q
Q
Q3
1022 1023
PC
Detected
Q4
Failure
Clock
Preliminary
Q1
The frequency of the internal oscillator will depend upon
the value contained in the IRCF bits (OSCCON<6:4>).
Upon entering the Fail-Safe condition, the OSTS bit
(OSCCON<3>) is automatically cleared to reflect that
the internal oscillator is active and the WDT is cleared.
The SCS bit (OSCCON<0>) is not updated. Enabling
FSCM does not affect the LTS bit.
The FSCM sample clock is generated by dividing the
LFINTOSC clock by 64. This will allow enough time
between FSCM sample clocks for a system clock edge
to occur. Figure 3-8 shows the FSCM block diagram.
On the rising edge of the sample clock, the monitoring
latch (CM = 0) will be cleared. On a falling edge of the
primary system clock, the monitoring latch will be set
(CM = 1). In the event that a falling edge of the sample
clock occurs and the monitoring latch is not set, a clock
failure has been detected. The assigned internal
oscillator is enabled when FSCM is enabled, as
reflected by the IRCF.
Q2
Note 1: Two-Speed Start-up is automatically
2: Primary clocks with a frequency of
PC + 1
enabled
Monitor mode is enabled.
FSCM. A slow starting oscillator can
cause an FCSM interrupt.
~488 Hz will be considered failed by
Q3
when
© 2005 Microchip Technology Inc.
Q4
the
Fail-Safe
PC + 2
Q1
Clock
Related parts for PIC12F639
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![PIC12F1840-I/P](/photos/16/3/160349/pdip8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core 8 PDI
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1840-I/MF](/photos/16/0/160077/dfn8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12F1840-I/MF](/photos/16/0/160077/dfn8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core 8 DFN
Manufacturer:
Microchip Technology
![PIC12F1840-I/SN](/photos/16/3/160347/soic8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core 8 SOI
Manufacturer:
Microchip Technology
![PIC12LF1840-E/MF](/photos/16/0/160077/dfn8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1840-E/P](/photos/16/3/160349/pdip8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1840-E/SN](/photos/16/3/160347/soic8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1840-I/P](/photos/16/3/160349/pdip8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
![PIC12LF1840-I/SN](/photos/16/3/160347/soic8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
![PIC12LF1840T-I/MF](/photos/16/0/160077/dfn8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1840T-I/SN](/photos/16/3/160347/soic8_tmb.jpg)
Part Number:
Description:
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
Manufacturer:
Microchip Technology
Datasheet:
![PIC12](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
8-Pin/ 8-Bit CMOS Microcontroller with EEPROM Data Memory
Manufacturer:
Microchip Technology
![PIC12F1822-I/MF](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC, 8BIT MCU, PIC12, 32MHZ, DFN-8
Manufacturer:
Microchip Technology
Datasheet:
![PIC12LF1822-I/MF](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC, 8BIT MCU, PIC12, 32MHZ, DFN-8
Manufacturer:
Microchip Technology
Datasheet:
![PIC-0903](/images/no-image3.png)
Part Number:
Description:
Photo IC(photodiode with signal processing)
Manufacturer:
KODENSHI KOREA CORP
Datasheet: