ST72F264G ST Microelectronics, ST72F264G Datasheet - Page 140

• Manufacturer Part Number: ST72F264G
• Description: (ST72F260G - ST72F264G) 8-BIT MCU
• Manufacturer: ST Microelectronics

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DataSheet
ST72260G, ST72262G, ST72264G
EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to V
local protection between the pad and V
5b) is implemented to completely absorb the posi-
tive ESD discharge.
Figure 79. Positive Stress on a True Open Drain Pad vs. V
Figure 80. Negative Stress on a True Open Drain Pad vs. V
Figure 81. Multisupply Configuration
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Main path
Path to avoid
Main path
4
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V
V
DD
DD
SS
are not implemented. An additional
V
V
V
V
SS
SS
DD
DD
V
AREF
V
SSA
(5a)
(3b)
(3b)
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SS
(3b)
(5a &
OUT
OUT
BACK TO BACK DIODE
Multisupply Configuration
When several types of ground (V
power supply (V
any reason (better noise immunity...), the structure
shown in
device against ESD.
BETWEEN GROUNDS
(4)
(4)
SS
DD
Figure 81
IN
IN
(2b)
DD
, V
is implemented to protect the
AREF
(2b)
(1)
(1)
, ...) are available for
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SS
V
V
(3b)
(5b)
, V
SSA
AREF
SSA
, ...) and
V
V
V
V
SS
SS
DD
DD
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