UPD75518 NEC, UPD75518 Datasheet - Page 175

• Manufacturer Part Number: UPD75518
• Description: 4 BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC

11. RECOMMENDED SOLDERING CONDITIONS
under different conditions.
WS60-162-1
IR30-162-1
VP15-162-1
Partial heating
method
The following conditions must be met when soldering the PD75518(A).
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and
Caution Do not apply more than a single process at a time, except for “Partial heating method.”
For more details, refer to our document “SMT MANUAL” (IEI-1207).
PD75518GF(A)-
Symbol
relative humidity at 65 % or less.
Part number
-3B9
Wave soldering
Infrared ray reflow
VPS
Partial heating method
Soldering process
Table 11-1 Recommended Soldering Conditions
80-pin plastic QFP (14 mm
Table 11-2 Soldering Conditions
Temperature in the soldering vessel: 260 ˚C or less
Soldering time: 10 seconds or less
Number of soldering processes: 1
Exposure limit
Pre-heating temperature: 120 ˚C max.
Peak package’s surface temperature: 230 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or more)
Number of reflow processes: 1
Exposure limit
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or more)
Number of reflow processes: 1
Exposure limit
Terminal temperature: 300 ˚C or less
Flow time: 3 seconds or less (one side per device)
Package
(16 hours of pre-baking is required at 125 ˚C afterward.)
(package surface temperature)
(16 hours of pre-baking is required at 125 ˚C afterward.)
(16 hours of pre-baking is required at 125 ˚C afterward.)
Note
Note
Note
20 mm)
: 2 days
: 2 days
: 2 days
Soldering conditions
WS60-162-1
IR30-162-1
VP15-162-1
Partial heating method
Symbol
PD75518(A)
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