UPD77111 NEC, UPD77111 Datasheet - Page 75

• Manufacturer Part Number: UPD77111
• Description: 16-BIT FIXED-POINT DIGITAL SIGNAL PROCESSORS
• Manufacturer: NEC

12. RECOMMENDED SOLDERING CONDITIONS
MOUNTING TECHNOLOGY MANUAL” (C10535E).
Surface mount type
PD77110GC-9EU: 100-pin plastic TQFP (fine pitch) (14
PD77111GK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12
PD77112GC-xxx-9EU: 100-pin plastic TQFP (fine pitch) (14
Infrared ray reflow
VPS
Partial heating method
Infrared ray reflow
VPS
Partial heating method
It is recommended to solder this product under the following conditions.
For details of the recommended soldering conditions, refer to information document “SEMICONDUCTOR DEVICE
For soldering methods and conditions other than those recommended, consult NEC.
Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25 C, 65%
Caution Do not use two or more soldering methods in combination (except partial heating method).
Process
Process
RH MAX.
Package peak temperature: 235 C, Time: 30 seconds MAX (210 C MIN),
Number of times: 2 MAX, Number of days: 3
necessary for 10 hours)
Package peak temperature: 215 C, Time: 30 seconds MAX (210 C MIN),
Number of times: 2 MAX, Number of days: 3
necessary for 10 hours)
Pin temperature: 300 C MAX, Time: 3 seconds MAX (per side of device)
Package peak temperature: 235 C, Time: 30 seconds MAX (210 C MIN),
Number of times: 3 MAX, Number of days: 7
necessary for 10 hours)
Package peak temperature: 215 C, Time: 30 seconds MAX (210 C MIN),
Number of times: 3 MAX, Number of days: 7
necessary for 10 hours)
Pin temperature: 300 C MAX, Time: 3 seconds MAX (per side of device)
Data Sheet U12801EJ4V0DS00
Conditions
Conditions
14 mm)
12 mm)
14 mm)
Note
Note
Note
Note
(after that, prebaking is
(after that, prebaking is
(after that, prebaking is
(after that, prebaking is
PD77110, 77111, 77112
VP15-103-2
VP15-107-3
IR35-103-2
IR35-107-3
Symbol
Symbol
75