MCP6272 Microchip Technology Inc., MCP6272 Datasheet - Page 23

• Manufacturer Part Number: MCP6272
• Description: 170 ?a, 2 Mhz Rail-to-rail Op Am
• Manufacturer: Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
© 2006 Microchip Technology Inc.
Note:
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
3. Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
shall not exceed 0.15 mm per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1
2
b
D
e
Dimension Limits
E1
A2
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
E
Units
c
A2
A1
E1
L1
N
D
e
A
E
L
ϕ
b
c
MIN
0.75
0.00
0.40
0.08
0.22
—
0°
MCP6271/1R/2/3/4/5
MILLIMETERS
L1
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
—
—
—
—
—
8
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS21810E-page 23
ϕ