MCP6272 Microchip Technology Inc., MCP6272 Datasheet - Page 24

• Manufacturer Part Number: MCP6272
• Description: 170 ?a, 2 Mhz Rail-to-rail Op Am
• Manufacturer: Microchip Technology Inc.

MCP6271/1R/2/3/4/5
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21810E-page 24
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
D
n
p
A
E
L
c
B
α
β
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.155
.100
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
6.60
9.78
3.43
0.38
1.78
0.56
4.32
3.68
8.26
15
15