MCP6272 Microchip Technology Inc., MCP6272 Datasheet - Page 27

• Manufacturer Part Number: MCP6272
• Description: 170 ?a, 2 Mhz Rail-to-rail Op Am
• Manufacturer: Microchip Technology Inc.

14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
c
n
45°
β
Dimension Limits
§
E1
E
Units
A2
E1
A1
D
p
A
E
L
B
α
n
h
φ
c
β
h
2
1
MIN
L
φ
.053
.052
.004
.228
.150
.337
.010
.016
.008
.014
D
0
0
0
INCHES*
A1
NOM
.050
A
14
.056
.007
.236
.154
.342
.015
.033
.009
.017
.061
12
12
4
MAX
MCP6271/1R/2/3/4/5
.069
.010
.244
.157
.347
.020
.050
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
8.56
0.25
0.20
0.36
3.81
0.41
0
0
0
MILLIMETERS
NOM
1.27
14
α
1.55
1.42
0.18
5.99
3.90
8.69
0.38
0.84
0.23
0.42
12
12
4
A2
MAX
Revised 7-20-06
1.75
1.55
0.25
6.20
3.99
1.27
0.25
8.81
0.51
0.51
15
15
DS21810E-page 27
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