MCP6272 Microchip Technology Inc., MCP6272 Datasheet - Page 26

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MCP6272

Manufacturer Part Number
MCP6272
Description
170 ?a, 2 Mhz Rail-to-rail Op Am
Manufacturer
Microchip Technology Inc.
Datasheet

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MCP6271/1R/2/3/4/5
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21810E-page 26
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
β
eB
E1
E
Dimension Limits
2
1
§
c
D
Units
A2
B1
eB
A1
E1
A
E
D
B
n
p
L
c
α
β
A
A1
MIN
.140
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
0.38
6.10
3.18
0.20
1.14
0.36
7.87
2.92
7.62
p
5
5
MILLIMETERS
© 2006 Microchip Technology Inc.
α
NOM
19.05
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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