spakdsp301vl100 Freescale Semiconductor, Inc, spakdsp301vl100 Datasheet - Page 89

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spakdsp301vl100

Manufacturer Part Number
spakdsp301vl100
Description
Dsp56301 24-bit Digital Signal Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
3.2 TQFP Package Mechanical Drawing
Freescale Semiconductor
Pin 1
ident
T
L
52
4X
1
C
208
53
0.2
C2
T
Figure 3-3.
A1
L-M
S1
C1
0.05
N
View AA
DSP56301 Mechanical Information, 208-pin TQFP Package
(K)
A
S
DSP56301 Technical Data, Rev. 10
N
(Z)
E
3X
(W)
q
view Y
1
q
CASE 998-01
4X
4X 52 TIPS
2X R
(2) q
0.25
Gage
plane
157
104
R1
156
105
M
B1
View AA
0.2
V1
T
Seating
plane
0.08
B
L-M
V
T
N
7. Dimension d does not include dambar
Notes:
6. Dimensions A and B do not include
2. Controlling dimension: millimeter.
3. Datum plane-H- is located at bottom of
4. Datums -L-, -M-, and -N- to be
5. Dimensions S and V to be determined
208X
1. Dimensioning and tolerancing per ANSI
0.35 minimum space between
determined at datum plane -H-.
do include mold mismatch and are
determined at datum plane -H-.
protrusion. Dambar protrusion shall
not cause the lead width to exceed
Y14.5M, 1982.
at seating place -T-.
mold protrusion. Allowable protrusion
is 0.25 per side. Dimensions A and B
protrusion and adjacent lead 0.07.
lead and is coincident with the lead
where the lead exits the plastic body at
the bottom of the parting line.
C L
Plating
TQFP Package Mechanical Drawing
AB
AB
DIM
C1
C2
R1
A1
B1
S1
V1
q
q
W
C
D
G
U
J
rotated 90
A
B
E
F
K
P
S
V
Z
q
J
1
2
Section AB-AB
Millimeters
0.08
MIN
0.05
1.35
0.17
0.45
0.17
0.09
0.10
0.09
28.00 BSC
14.00 BSC
28.00 BSC
14.00 BSC
30.00 BSC
15.00 BSC
30.00 REF
15.00 REF
0.50 BSC
0.50 REF
0.25 BSC
0.20 REF
1.00 REF
208 places
12 REF
0
0
---
M
View Y
F
D
0
MAX
1.60
1.45
0.27
0.75
0.23
0.20
0.20
0.16
T L-M N
clockwise
7
---
---
X= L, M or N
X
U
Base metal
G
P
3-11

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