pcf8564a NXP Semiconductors, pcf8564a Datasheet - Page 2

• Manufacturer Part Number: pcf8564a
• Description: Real Time Clock And Calendar
• Manufacturer: NXP Semiconductors

NXP Semiconductors
4. Ordering information
Table 1.
[1]
5. Marking
PCF8564A_1
Product data sheet
Type number
Die type 1
PCF8564AU/5BD/1
PCF8564AU/5GE/1
PCF8564AU/10AA/1
Die type 2
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/10AB/1
Die type 3
PCF8564ACX9/1
PCF8564ACX9/B/1
Not to be used for new designs.
[1]
Ordering information
Table 2.
Package
Name
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564ACX9 wafer level chip-size package;
PCF8564ACX9 wafer level chip-size package;
Type number
Die type 1
PCF8564AU/5BD/1
PCF8564AU/5GE/1
PCF8564AU/10AA/1
Die type 2
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/10AB/1
Die type 3
PCF8564ACX9/1
PCF8564ACX9/B/1
Marking codes
Description
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
9 bumps; 1.27
9 bumps; 1.27
Rev. 1 — 8 October 2009
1.9
1.9
0.29 mm
0.29 mm
Marking code
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
Delivery form
unsawn wafer;
thickness 280 m
unsawn wafer;
thickness 687 m
wafer sawn on FFC;
thickness 200 m
unsawn wafer;
thickness 280 m
unsawn wafer;
thickness 687 m
wafer sawn on FFC;
thickness 200 m
wafer sawn on FFC;
thickness 200 m;
die with solder bumps
tape and reel;
thickness 200 m;
die with solder bumps
Real time clock and calendar
PCF8564A
© NXP B.V. 2009. All rights reserved.
Version
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564ACX9
PCF8564ACX9
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