pcf8564a NXP Semiconductors, pcf8564a Datasheet - Page 37

• Manufacturer Part Number: pcf8564a
• Description: Real Time Clock And Calendar
• Manufacturer: NXP Semiconductors

NXP Semiconductors
19. Soldering of WLCSP packages
PCF8564A_1
Product data sheet
18.2 Tape and reel information
19.1 Introduction to soldering WLCSP packages
Table 34.
[1]
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description” .
Wave soldering is not suitable for this package.
Dimension
W
A0
B0
K0
P1
Fig 32. Tape and reel details for PCF8564ACX9/B/1
Fig 33. Pin 1 indication for PCF8564ACX9/B/1
Die is placed in pocket bump side down.
Transparent top view. The orientation of the IC in a pocket is indicated by the position of pin 1, with
respect to the sprocket holes.
Tape and reel dimensions
W
B0
Rev. 1 — 8 October 2009
Description
tape width
pocket length
pocket width
pocket depth
pocket pitch
4 mm
direction of feed
P1
pin 1
[1]
A0
013aaa191
Real time clock and calendar
Value
8 mm
1.5 mm
2.2 mm
0.25 mm
4 mm
013aaa202
PCF8564A
K0
© NXP B.V. 2009. All rights reserved.
37 of 44