pcf8564a NXP Semiconductors, pcf8564a Datasheet - Page 40

• Manufacturer Part Number: pcf8564a
• Description: Real Time Clock And Calendar
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PCF8564A_1
Product data sheet
19.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description” .
Cleaning can be done after reflow soldering.
Rev. 1 — 8 October 2009
Real time clock and calendar
PCF8564A
© NXP B.V. 2009. All rights reserved.
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