epm2210gm100i Altera Corporation, epm2210gm100i Datasheet - Page 5

• Manufacturer Part Number: epm2210gm100i
• Description: Section I. Max Ii Device Family Data Sheet
• Manufacturer: Altera Corporation

Altera Corporation
December 2007
Table 1–2
MAX II devices are available in space-saving FineLine BGA, Micro
FineLine BGA, and thin quad flat pack (TQFP) packages (refer to
Tables 1–3
same package (for example, you can migrate between the EPM570,
EPM1270, and EPM2210 devices in the 256-pin FineLine BGA package).
Vertical migration means that you can migrate to devices whose
dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density
in any package has the highest number of power pins; you must lay out
for the largest planned density in a package to provide the necessary
power pins for migration. For I/O pin migration across densities, cross
reference the available I/O pins using the device pin-outs for all planned
densities of a given package type to identify which I/O pins can be
migrated. The Quartus
place all pins for you when given a device migration list.
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
Table 1–2. MAX II Speed Grades
Device
shows MAX II device speed-grade offerings.
and 1–4). MAX II devices support vertical migration within the
®
–3
v
v
v
v
—
—
II software can automatically cross-reference and
v
v
v
v
–4
—
—
MAX II Device Handbook, Volume 1
Speed Grade
v
v
v
v
–5
—
—
–6
v
v
—
—
—
—
Introduction
v
v
–7
—
—
—
—
1–3