xc4000a Xilinx Corp., xc4000a Datasheet

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xc4000a

Manufacturer Part Number
xc4000a
Description
Logic Cell Array Family
Manufacturer
Xilinx Corp.
Datasheet
Features
Device
Table 1. The XC4000A Family of Field-Programmable Gate Arrays
Third Generation Field-Programmable Gate Arrays
Flexible Array Architecture
Sub-micron CMOS Process
Systems-Oriented Features
XACT Development System runs on ’386/’486-type PC,
NEC PC, Apollo, Sun-4, and Hewlett-Packard 700 Series
Appr. Gate Count
CLB Matrix
Number of CLBs
Number of Flip-Flops
Max Decode Inputs (per side)
Max RAM Bits
Number of IOBs
– Abundant flip-flops
– Flexible function generators
– On-chip ultra-fast RAM
– Dedicated high-speed carry-propagation circuit
– Wide edge decoders (two per edge)
– Hierarchy of interconnect lines
– Internal 3-state bus capability
– Eight global low-skew clock or signal distribution
– Programmable logic blocks and I/O blocks
– Programmable interconnects and wide decoders
– High-speed logic and Interconnect
– Low power consumption
– IEEE 1149.1-compatible boundary-scan logic support
– Programmable output slew rate (4 modes)
– Programmable input pull-up or pull-down resistors
– 24-mA sink current per output (48 per pair)
Configured by Loading Binary File
– Unlimited reprogrammability
– Six programming modes
– Interfaces to popular design environments like
– Fully automatic partitioning, placement and routing
– Interactive design editor for design optimization
– 288 macros, 34 hard macros, RAM/ROM compiler
network
Viewlogic, Mentor Graphics and OrCAD
XC4002A
2,000
2,048
8 x 8
256
64
24
64
2-71
XC4000A
Logic Cell Array Family
Product Specifications
Description
The XC4000A family of FPGAs offers four devices at the low
end of the XC4000 family complexity range. XC4000A
differs from XC4000 in four areas: fewer routing resources,
fewer wide-edge decoders, higher output sink current, and
improved output slew-rate control.
Note that the XC4003 and XC4005 devices are available in
both flavors, the lower-priced XC4003A/XC4005A with re-
duced routing, and the higher-priced XC4003/XC4005 with
more abundant routing resources. The XC4000A devices
are intended for less demanding and more structured
designs, and the XC4000 devices for more random designs
requiring additional routing resources.
The equivalent devices are pin-compatible and are avail-
able in identical packages, but they are not bitstream
compatible. In order to move from a XC4000A to a XC4000,
or vice versa, the design must be recompiled.
The XC4000 routing structure is optimized for smaller
designs, naturally requiring fewer routing resources. The
XC4000A devices have four Longlines and four single-
length lines per row and column, while the XC4000
devices have six Longlines and eight single-length lines
per row and column. This results in a smaller chip area
and lower cost per device.
XC4000A has two wide-edge decoders on every device
edge, while the XC4000 has four. All other wide-decoder
features are identical in XC4000 and XC4000A.
XC4000A outputs are specified at 24 mA, sink current,
while XC4000 outputs are specified at 12 mA. The source
current is the same 4 mA for both families.
The XC4000A family offers a more sophisticated output
slew-rate control structure with four configurable options
for each individual output driver: fast, medium fast, me-
dium slow, and slow. Slew-rate control can alleviate
ground-bounce problems when multiple outputs switch
simultaneously, and it can reduce or eliminate crosstalk
and transmission-line effects on printed circuit boards.
XC4003A
10 x 10
3,000
3,200
100
360
30
80
XC4004A
12 x 12
4,000
4,608
144
480
36
96
XC4005A
14 x 14
5,000
6,272
196
616
112
42

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xc4000a Summary of contents

Page 1

... XC4000 devices for more random designs requiring additional routing resources. The equivalent devices are pin-compatible and are avail- able in identical packages, but they are not bitstream compatible. In order to move from a XC4000A to a XC4000, or vice versa, the design must be recompiled. XC4002A XC4003A ...

Page 2

... XC4000A Logic Cell Array Family Absolute Maximum Ratings Symbol Description V Supply voltage relative to GND CC V Input voltage with respect to GND IN V Voltage applied to 3-state output TS T Storage temperature (ambient) STG T Maximum soldering temperature ( 1/16 in. = 1.5 mm) SOL T Junction temperature J Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. ...

Page 3

Wide Decoder Switching Characteristic Guidelines Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Since many internal timing parameters cannot be measured directly, there derived from benchmark timing patterns. The ...

Page 4

... XC4000A Logic Cell Array Family Horizontal Longline Switching Characteristic Guidelines Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions ...

Page 5

Guaranteed Input and Output Parameters (Pin-to-Pin) All values listed below are tested directly. and guaranteed over the operating conditions. The same parameters can also be derived indirectly from the IOB and Global Buffer specifications. The XACT delay calculator uses this ...

Page 6

... XC4000A Logic Cell Array Family IOB Switching Characteristic Guidelines Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions ...

Page 7

CLB Switching Characteristic Guidelines Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing patterns. The ...

Page 8

... XC4000A Logic Cell Array Family CLB Switching Characteristic Guidelines (continued) Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions ...

Page 9

CLB RAM Timing Characteristics ADDRESS WRITE WRITE ENABLE DATA IN READ X,Y OUTPUTS VALID READ, CLOCKING DATA INTO FLIP-FLOP CLOCK XQ,YQ OUTPUTS READ DURING WRITE WRITE ENABLE DATA IN (stable during WE) X,Y OUTPUTS DATA IN (changing during WE) X,Y ...

Page 10

... XC4000A Logic Cell Array Family 2-80 ...

Page 11

Pin Bound Description PC 84 PQ100 VQ100 PG120 Scan VCC – I/O (A8 I/O (A9 – – – ...

Page 12

... XC4000A Logic Cell Array Family Pin Description PC84 VQ100 PQ100 PG120 VCC 2 89 I/O (A8 I/O (A9 I/O – 92 I/O – 93 I/O (A10 I/O (A11 – – – I/O (A12 I/O (A13 – – – – – – I/O (A14 SGCK1 (A15,I/ VCC ...

Page 13

Pin Bound Description PC84 TQ144 PQ160 PG120 Scan VCC 2 128 142 G3 I/O (A8) 3 129 143 G1 I/O (A9) 4 130 144 F1 I/O – 131 145 E1 I/O – 132 146 F2 I/O (A10) 5 133 147 ...

Page 14

... XC4000A Logic Cell Array Family Pin Description PC84 TQ144 PQ160 PQ208 PG156 VCC 2 128 142 I/O (A8) 3 129 143 I/O (A9) 4 130 144 I/O – 131 145 I/O – 132 146 – – – – – – – – I/O (A10) 5 133 147 I/O (A11) 6 134 148 I/O – ...

Page 15

XC4005A Pinouts (continued) Pin Descriptions PC84 TQ144 I/O – 80 – – – – – – – – – – – – GND – 81 I/O – 82 I/O – 83 I/O (D5 I/O (CS0 – ...

Page 16

... XC4000A Logic Cell Array Family For a detailed description of the device architecture, see pages 2-9 through 2-31. For a detailed description of the configuration modes and their timing, see pages 2-32 through 2-55. For detailed lists of package pinouts, see pages 2-57 through 2-81 through 2-85. For package physical dimensions and thermal data, see Section 4. ...

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