mpc8245ec Freescale Semiconductor, Inc, mpc8245ec Datasheet - Page 31

• Manufacturer Part Number: mpc8245ec
• Description: Mpc8245 Integrated Host Processor
• Manufacturer: Freescale Semiconductor, Inc

5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package Outline
Interconnects
Pitch
Solder Balls
Solder Ball Diameter
Maximum Module Height
Co-Planarity Specification
Maximum Force
Package Parameters
TDI, TMS
TDO
TDO
TCK
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
35 mm × 35 mm
1.27 mm
VV (Lead-free version of package)
1.65 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
352
ZU (TBGA package)
0.75 mm
12
13
—
62 Sn/36 Pb/2 Ag
Input Data Valid
10
Output Data Valid
11
—
95.5 Sn/4.0 Ag/0.5 Cu
Package Description
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