mpc8245ec Freescale Semiconductor, Inc, mpc8245ec Datasheet - Page 50

• Manufacturer Part Number: mpc8245ec
• Description: Mpc8245 Integrated Host Processor
• Manufacturer: Freescale Semiconductor, Inc

System Design
7.8
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks can be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.
Figure 27
options.
Figure 28
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A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
from adjacent components.
A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from
adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high
board-level thermal loading from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low
board-level thermal loading from adjacent components.
Thermal Management
displays a package-exploded cross-sectional view of a TBGA package with several heat sink
depicts the die junction-to-ambient thermal resistance for four typical cases:
Figure 27. Package-Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Adhesive or
Material
Heat Sink
Die
Heat Sink
Clip
Printed-Circuit Board
TBGA Package
Option
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