lpc1778 NXP Semiconductors, lpc1778 Datasheet - Page 4

• Manufacturer Part Number: lpc1778
• Description: 32-bit Arm Cortex-m3 Microcontroller; Up To 512 Kb Flash And 96 Kb Sram; Usb Device/host/otg; Ethernet; Lcd; Emc
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC178x_7x
Objective data sheet
Type number
LPC1788
LPC1788FBD208
LPC1788FET208
LPC1788FET180
LPC1788FBD144
LPC1787
LPC1787FBD208
LPC1786
LPC1786FBD208
LPC1785
LPC1785FBD208
LPC1778
LPC1778FBD208
LPC1778FET208
LPC1778FET180
LPC1778FBD144
LPC1777
LPC1777FBD208
LPC1776
LPC1776FBD208
LPC1776FET180
Ordering information
Package
Name
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
LQFP208
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
TFBGA180
Versatile pin function selection feature allows many possibilities for using on-chip
peripheral functions.
Unique device serial number for identification purposes.
Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of −40 °C to 85 °C.
Available as LQFP208, TFBGA208, TFBGA180, and LQFP144 package.
<tbd>
An on-chip PLL allows CPU operation up to the maximum CPU rate without the
need for a high-frequency crystal. May be run from the main oscillator or the
internal RC oscillator.
A second, dedicated PLL may be used for USB in order to allow added flexibility for
the Main PLL settings.
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15 × 15 × 0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm
plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15 × 15 × 0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm
plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm
All information provided in this document is subject to legal disclaimers.
Rev. 00.04 — 8 July 2010
32-bit ARM Cortex-M3 microcontroller
LPC178x/7x
© NXP B.V. 2010. All rights reserved.
Version
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT570-2
4 of 112