lpc1778 NXP Semiconductors, lpc1778 Datasheet - Page 73

• Manufacturer Part Number: lpc1778
• Description: 32-bit Arm Cortex-m3 Microcontroller; Up To 512 Kb Flash And 96 Kb Sram; Usb Device/host/otg; Ethernet; Lcd; Emc
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 9.
V
LPC178x_7x
Objective data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•
−
=
T
R
P
40
amb
D
th(j-a)
T
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
= the package junction-to-ambient thermal resistance (°C/W)
+
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 00.04 — 8 July 2010
–
)
)
J
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
LPC178x/7x
Max
125
© NXP B.V. 2010. All rights reserved.
Unit
73 of 112
°C
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